㈜가나는 첨단 본딩 솔루션 전문기업으로 반도체 패키징 관련 소재와 장비를 함께 공급하고 있습니다.소재로는 다양한 산업용 기능성 접착제 열 경화용, 혐기성 및 UV 경화 소재 및 경화 장비 등 One Bonding Solution을 제공하고 있습니다.장비로는  첨단 패키징 관련 연구 개발 목적의 정밀 Flip chip bonder, 시제품 및 연구 개발에 접합한 탁상용 RTP & 진공 리플로우 오븐, RDL repair와 바이오 센서 등 나노급 패턴을 특허 공법으로 구현이 가능한 정밀 프린터, 그리고 레이저를 이용한 솔더볼 젯팅장비와 LAB 장비, 양산용 자동 와이어 본더를 공급하고 있습니다.

Gana Co., Ltd. is a leading-edge bonding solutions company, supplying both materials and equipment for semiconductor packaging.

We offer a comprehensive range of materials, including a variety of industrial functional adhesives for thermal curing, anaerobic and UV curing, and curing equipment, all encompassing a single bonding solution.

Our equipment includes precision flip chip bonders for advanced packaging research and development; tabletop RTP and vacuum reflow ovens for prototypes and R&D; precision printers capable of implementing nanoscale patterns for RDL repair and biosensors using a patented process; laser-based solder ball jetting equipment, lab equipment, and automated wire bonders for mass production.