|
|
| |
Semiconductor & Display
Exhibition 2003 |
Venue
|
Atlantic
Hall, COEX 3rd Floor |
| Date |
23(Tuesday) ¢¦ 25(Thursday) September, 2003.
|
Installation Period
|
: 21 ¢¦ 22 September. <two days> |
Dismantling Period
|
: 26 September. <one day> |
|
Organizer
|
KSIA(Korea
Semiconductor Industry Association) |
Supported
by
|
Ministry of
Commerce Industry and Energy,
Ministry of Science and Technology |
Sponsors
|
Dong Bu Electronics,
Samsung Electronics, Hynix Semiconductor |
 5-year-history
SEDEX which is a unique multiplex exhibition in Korea, offers a chance
to experience state of the art technologies in semiconductor and LCD-related
products. |
| KSIA chose
COEX as a venue, which brought about huge success last year. Not only
will the 5th SEDEX Korea focus on its exposition scale, but also carefully
consider effectiveness in contents, allowing the participants to promote
their exhibits in a maximal way. |
|
| Benefits from
participating in SEDEX |
|
 A wide
variety of diverse visitors |
- Unlike other exhibitions where average people mainstream the
visitation, visitors to SEDEX Korea consist of engineers and purchase
managers from well-known leading domestic semiconductor companies.
All the exhibitors will make the most of it, when it comes to promoting
their merchandise.
- Besides, such accessory events as Technical Seminar, Exposition
for Semiconductor Components(estimated), Appraisal Conference of the
Research Achievements from the System IC 2010 Project(estimated),
and the 5th Competition of Korea Semiconductor Technology Development
will be held during the period of SEDEX Korea. Celebrities and experts
from government, industry and academy will make the SEDEX Korea more
welcoming. |
| Support
of invitation of overseas buyers for business talks |
- Prior to SEDEX Korea, KSIA takes exhibitors' request for inviting
overseas buyers with whom they wish to have business talks. Round-trip
airfares and all the expenses necessary for their stay will be on
KSIA.
- Furthermore, KSIA will schedule to take them to the exhibitors'
production facilities and factories for better discussions. |
| Expansion
and reinforcement of the realms including LCD sector |
| - By widening the areas of participation, SEDEX intends to be an
authentic multi-exhibition related to semiconductor. As a way of intensifying
LCD sector in particular, KSIA will try to attract as many domestic
and overseas buyers as possible in this field. |
| Offering
clean and spacious Business Center |
| - In order to get the business talks between the exhibitors and
buyers going smoothly, KSIA will operate Business Center for their
own. |
| ¡Ø The motion pictures of SEDEX Korea 2002 are available at www.sedex.org |
| Date |
9 ¢¦ 11 September, 2002 |
| Venue |
COEX 3F Atlantic Hall |
| Visitor |
7,132 |
|
| SEDEX Korea
2002 Attendee |
|
company
|
name |
CSIA
|
Yu Zhongyu |
CSIA
|
Guo Yiran |
CSIA
|
Louisa |
Tianshui Yonghong
|
Song Yong |
Tianshui Yonghong
|
Chang Wenying |
Huayue Microelectronics
|
Lu Ning |
Shenzhen investment
|
Xue Bo |
Shenzhen investment
|
Zhou Ping |
Shenzhen Shencaho S&T
|
Hu Ze |
Shenzhen Shencaho S&T
|
Li Minwen |
Mitsubishi Electric
|
Okuno |
Sumitomo
|
Watanabe |
| SICA |
Zou Shichang |
|
| company |
name |
Fudan University
|
Tang Pushan |
Huajie IC Technology
|
Xu Xiufa |
Belling Corp.
|
Wang Longxing |
Institute of Standardization
|
Wang Jiazheng |
Pascon Microelectronics
|
Wang Yuanbiao |
Zhangjiang Investment
|
Ying Hong |
SICA
|
Sun Meiyu |
| Lingsen |
Andy Yang |
Ramtec Semiconductor
|
Kuo Winter |
King Yuan Electronics
|
Mills Chen |
Kingbond
|
Jeff Chen |
Kingbond
|
Dick Lee |
|
|
| Item categories
of participation |
|
DEVICE
|
Foundries and Contract Manufacturing Services
- Pakaging, Assembly, Wafer Processing or Foundry Service, FPD
etc |
|
| Fabless Houses |
|
| Micro Systems Technology |
|
| Flat Panel Display(LCD, PDP, Organic EL etc) |
|
Equipment
Manufactures
|
Process Equipment
- Bumping Systems, Ion Implantation Equipment, CVD, PVD, CMP,Marking
Equipment, CMP etc |
|
Assembly Equipment
- Backgrind, Slicing, Polishing, Cleaning, Washing, Dicing,
Sawing . Equipment, Attach Systems etc |
|
Test Equipment
- Burn - In Systems, Failure Analysis Systems, Probers,FPD Tester
/ Measurement Equipment, Memory Test Systems,Package Test Systems,
SOC Test Systems etc |
|
Inspection & Measurement Equipment
- Microscopes, Wire Bonding Inspection, Surface Particle Scanners
etc |
|
General Equipment
- Cutting / Drilling / Laser Beveling Equipment Repair Equipment,Vacuum
Packaging Equipment, Lamination etc |
|
Flat Panel Display Equipment
- Alignment Film Coating Equipment, Liquid Crystal Injection
or Filling Equipment, Rubbing Equipment, Spacer Spraying Equipment
etc |
|
Factory
Facility
|
Air Filtering, Clean Rooms, Flow
/ Process Control etc |
Material
|
Materials Of Assembly, Chemicals
& Solids, Gases, FPD,Wafer Substrate
- Photomask, Wafer, Lead Frame etc
|
Components
& Parts
|
Sub Systems
- Braking Systems, Cameras, Electron Tube, Pumps, Vacuum etc |
|
Components & Parts
- Bearing, Filters, Sensors, Fittings, O - Rings, Resins, Tubes,Tube,
Motor etc |
|
Software
|
CAD, Package Simulation, Test Program
etc |
|
